SMT | Surface Mount Technology |
TH | Thru-hole Technology |
Mixed Technology | Both Thru-hole and Surface Mount Technologies |
Single & Double Sided | Double Sided Surfact Mount and Thru-hole Assembly |
Sn63 | Eutectic Tin-Lead Solder (63% tin, 37% lead) |
SAC305 | RoHS Compliant Lead-Free Solder (96.5% tin, 0.5% copper and 3% silver) |
No Minimum | We are happy to assemble just 1 prototype board if required. |
No Maximum | Fully capable of assembling up to 10,000 boards in a single production run. |
Labor Only Production | 4 week standard lead time after receipt of materials from customer. | |
Turnkey Production | 6-8 weeks standard lead total. | |
Quick Turn Production | 1 and 2 week turnaround available for production volumes. | |
Prototype | 48 Hour to 2 Week turns available for prototype runs. |
Passives | 01005, 0201 and above. |
Ball Grid Arrays (BGAs) | Includes 100% X-Ray Inspection |
Fine Pitch | Down to 8 mil pitch. |
Automated (AOI) | 3D Automated Optical Inspection, Verification of all SMT components. |
Visual | Visual Inspection using Mantis Microscopes (12x magnification) |
X-Ray | For BGAs and Leadless Components |
Functional Testing | Functional Testing and Programming with your Test Fixtures and Procedures |
Reels | Reels are the most cost effective and dependable packaging for passive components. |
Tubes & Trays | ICs typically come packaged in Trays or Tubes. |
Loose Parts | During prototyping loose parts are often unavoidable. We will accept these upon review. |
Cut Tape | Cut tape is accepted for ICs and passives sized 0603 and larger. |